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(chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right) (net 58 "/Level shifter/POKEY5.P2") (pinfunction "2") (pintype "passive") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "179ae20b-7df8-43ce-9718-c3812796e097") ) (pad "3" thru_hole roundrect (at -19.05 7.62) (size 1.3208 1.3208) (drill 0.8128) (layers "*.Cu" "*.Mask") (remove_unused_layers no) (roundrect_rratio 0.25) (chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right) (net 59 "/Level shifter/POKEY5.P3") (pinfunction "3") (pintype "passive") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "d9770028-83f7-49df-bb2f-0b332e1b8630") ) (pad "4" thru_hole roundrect (at -16.51 7.62) (size 1.3208 1.3208) (drill 0.8128) (layers "*.Cu" "*.Mask") (remove_unused_layers no) (roundrect_rratio 0.25) (chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right) (net 60 "/Level shifter/POKEY5.P4") (pinfunction "4") (pintype "passive") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "139f536c-8565-4b3b-b01a-c74454749a15") ) (pad "5" thru_hole roundrect (at -13.97 7.62) (size 1.3208 1.3208) (drill 0.8128) (layers "*.Cu" "*.Mask") (remove_unused_layers no) (roundrect_rratio 0.25) (chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right) (net 61 "/Level shifter/POKEY5.P5") (pinfunction "5") (pintype "passive") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "c1b5c82b-4747-46ca-9e05-797bac4fe70d") ) (pad "6" thru_hole roundrect (at -11.43 7.62) (size 1.3208 1.3208) (drill 0.8128) (layers "*.Cu" "*.Mask") (remove_unused_layers no) (roundrect_rratio 0.25) (chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right) (net 62 "/Level shifter/POKEY5.P6") (pinfunction "6") (pintype "passive") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "93b1f90e-6ada-4417-9793-ee5e57d42883") ) (pad "7" thru_hole roundrect (at -8.89 7.62) (size 1.3208 1.3208) (drill 0.8128) (layers "*.Cu" "*.Mask") (remove_unused_layers no) (roundrect_rratio 0.25) (chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right) (net 63 "/Level shifter/POKEY5.P7") (pinfunction "7") (pintype "passive") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "088ec968-f1cf-4028-b55d-ef4da4b31ca8") ) (pad "8" thru_hole roundrect (at -6.35 7.62) (size 1.3208 1.3208) (drill 0.8128) (layers "*.Cu" "*.Mask") (remove_unused_layers no) (roundrect_rratio 0.25) (chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right) (net 85 "/Level shifter/POKEY5.P8") (pinfunction "8") (pintype "passive") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "70206a90-06fc-48a3-9236-d5f15bc0d8d4") ) (pad "9" thru_hole roundrect (at -3.81 7.62) (size 1.3208 1.3208) (drill 0.8128) (layers "*.Cu" "*.Mask") (remove_unused_layers no) (roundrect_rratio 0.25) (chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right) (net 86 "/Level shifter/POKEY5.P9") (pinfunction "9") (pintype "passive") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "6e3fe3c2-e9da-4939-8be9-ced3b787cf25") ) (pad "10" thru_hole roundrect (at -1.27 7.62) (size 1.3208 1.3208) (drill 0.8128) (layers "*.Cu" "*.Mask") (remove_unused_layers no) (roundrect_rratio 0.25) (chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right) (net 87 "/Level shifter/POKEY5.P10") (pinfunction "10") (pintype "passive") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "627181ff-debf-4f32-946d-69c04491fa40") ) (pad "11" thru_hole roundrect (at 1.27 7.62) (size 1.3208 1.3208) (drill 0.8128) (layers "*.Cu" "*.Mask") (remove_unused_layers no) (roundrect_rratio 0.25) (chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right) (net 88 "/Level shifter/POKEY5.P11") (pinfunction "11") (pintype "passive") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid 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(remove_unused_layers no) (roundrect_rratio 0.25) (chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right) (net 90 "/Level shifter/POKEY5.P14") (pinfunction "14") (pintype "passive") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "9a65b6e4-bf52-42ac-a4a8-e9647462f61d") ) (pad "15" thru_hole roundrect (at 11.43 7.62) (size 1.3208 1.3208) (drill 0.8128) (layers "*.Cu" "*.Mask") (remove_unused_layers no) (roundrect_rratio 0.25) (chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right) (net 91 "/Level shifter/POKEY5.P15") (pinfunction "15") (pintype "passive") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "a6ab898e-3dd6-48f2-b233-e3e1956b25af") ) (pad "16" thru_hole roundrect (at 13.97 7.62) (size 1.3208 1.3208) (drill 0.8128) (layers "*.Cu" "*.Mask") (remove_unused_layers no) (roundrect_rratio 0.25) (chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right) (net 82 "/Level 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(chamfer top_left top_right bottom_left bottom_right) (net 94 "/Level shifter/POKEY5.P21") (pinfunction "21") (pintype "passive") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "bc4999ee-7dd1-4418-9e22-6ccb9b44c7d0") ) (pad "22" thru_hole roundrect (at 21.59 -7.62) (size 1.3208 1.3208) (drill 0.8128) (layers "*.Cu" "*.Mask") (remove_unused_layers no) (roundrect_rratio 0.25) (chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right) (net 93 "/Level shifter/POKEY5.P22") (pinfunction "22") (pintype "passive") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "f9e931df-95b8-4891-b753-abaedb04c594") ) (pad "23" thru_hole roundrect (at 19.05 -7.62) (size 1.3208 1.3208) (drill 0.8128) (layers "*.Cu" "*.Mask") (remove_unused_layers no) (roundrect_rratio 0.25) (chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right) (net 83 "/Level shifter/POKEY5.P23") (pinfunction "23") (pintype "passive") (solder_mask_margin 0.1016) 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"*.Cu" "*.Mask") (remove_unused_layers no) (roundrect_rratio 0.25) (chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right) (net 79 "/Level shifter/POKEY5.P26") (pinfunction "26") (pintype "passive") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "9c24af16-4098-484c-8f47-e5ba9f1c7c7e") ) (pad "27" thru_hole roundrect (at 8.89 -7.62) (size 1.3208 1.3208) (drill 0.8128) (layers "*.Cu" "*.Mask") (remove_unused_layers no) (roundrect_rratio 0.25) (chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right) (net 80 "/Level shifter/POKEY5.P27") (pinfunction "27") (pintype "passive") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "0b235d8e-8643-4dbd-8c68-e612dbf71f93") ) (pad "28" thru_hole roundrect (at 6.35 -7.62) (size 1.3208 1.3208) (drill 0.8128) (layers "*.Cu" "*.Mask") (remove_unused_layers no) (roundrect_rratio 0.25) (chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right) (net 68 "/Level 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(chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right) (net 73 "/Level shifter/POKEY5.P33") (pinfunction "33") (pintype "passive") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "a9fa062e-cfab-4d26-9984-3fecf4d403b8") ) (pad "34" thru_hole roundrect (at -8.89 -7.62) (size 1.3208 1.3208) (drill 0.8128) (layers "*.Cu" "*.Mask") (remove_unused_layers no) (roundrect_rratio 0.25) (chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right) (net 74 "/Level shifter/POKEY5.P34") (pinfunction "34") (pintype "passive") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "5be24f85-c490-4b4c-86c7-4e944c2ce34c") ) (pad "35" thru_hole roundrect (at -11.43 -7.62) (size 1.3208 1.3208) (drill 0.8128) (layers "*.Cu" "*.Mask") (remove_unused_layers no) (roundrect_rratio 0.25) (chamfer_ratio 0.2928932188) (chamfer top_left top_right bottom_left bottom_right) (net 75 "/Level shifter/POKEY5.P35") (pinfunction "35") (pintype "passive") 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270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 30 "unconnected-(U2-T$16-PadA10)") (pinfunction "T$16") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "271c7383-6d0a-46fc-a00a-9fceeb5f41e3") ) (pad "A11" smd roundrect (at 3.2 -4.8 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 112 "/FPGA/POKEY3.P29") (pinfunction "T$18") (pintype "bidirectional") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "8ecb3daf-b2dc-49c3-8a04-713714b0985f") ) (pad "A12" smd roundrect (at 4 -4.8 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 119 "/FPGA/POKEY3.P27") (pinfunction "T$20") (pintype "bidirectional") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "4cb98860-619f-4deb-8157-aa16ec897027") ) (pad "A13" smd roundrect (at 4.8 -4.8 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 4 "GND") 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(at 0 -4 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 18 "unconnected-(U2-T$13-PadB7)") (pinfunction "T$13") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "04959a51-c0bb-471c-91a5-dcdae553abcd") ) (pad "B8" smd roundrect (at 0.8 -4 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 4 "GND") (pinfunction "GND") (pintype "power_in") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "624c9a40-a41f-4ecd-8c87-953340c47d56") ) (pad "B9" smd roundrect (at 1.6 -4 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 6 "+3.3V") (pinfunction "DEV_CLRN") (pintype "bidirectional") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "edefb5a1-7d78-448f-b24d-56187615838d") ) (pad "B10" smd roundrect (at 2.4 -4 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 164 "unconnected-(U2-T$17-PadB10)") 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(roundrect_rratio 0.5) (net 3 "Net-(U2-NSTATUS)") (pinfunction "NSTATUS") (pintype "bidirectional") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "82a7b78a-4f32-4361-b6cf-6b811aefcdf5") ) (pad "C5" smd roundrect (at -1.6 -3.2 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 11 "Net-(U2-CONF_DONE)") (pinfunction "CONF_DONE") (pintype "bidirectional") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "4dd17101-ee57-48fc-90d3-7cb7a9ad5ac9") ) (pad "C6" smd roundrect (at -0.8 -3.2 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 6 "+3.3V") (pinfunction "VCCIO") (pintype "power_in") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "5b45dc5c-2124-4dea-8f51-b38a8013ce7c") ) (pad "C7" smd roundrect (at 0 -3.2 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 6 "+3.3V") (pinfunction "VCCIO") (pintype "power_in") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) 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0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 152 "unconnected-(U2-TB$7-PadC11)") (pinfunction "TB$7") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "c9164411-6ab1-4436-b9ff-48bc5a5831bd") ) (pad "C12" smd roundrect (at 4 -3.2 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 98 "/FPGA/POKEY3.P23") (pinfunction "TB$9") (pintype "bidirectional") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "94cc22eb-8497-4e5b-bc0e-835389dbdf3f") ) (pad "C13" smd roundrect (at 4.8 -3.2 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 124 "/FPGA/POKEY3.P24") (pinfunction "TB$11") (pintype "bidirectional") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "204a2a6c-19d0-48d5-aa14-ba0441ac5563") ) (pad "D1" smd roundrect (at -4.8 -2.4 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 99 "/FPGA/POKEY3.P36") (pinfunction "TB$2") (pintype "bidirectional") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "78d731fd-98f6-4e38-9e15-2aeff998f2c8") ) (pad "D2" smd roundrect (at -4 -2.4 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 57 "unconnected-(U2-NC-PadD2)") (pinfunction "NC") (pintype "no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "80835054-eafd-4780-959f-00fa003dc4b3") ) (pad "D3" smd roundrect (at -3.2 -2.4 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 24 "unconnected-(U2-NC-PadD3)") (pinfunction "NC") (pintype "no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "11087df5-4ea9-4fcf-8d75-8d75804429d2") ) (pad "D4" smd roundrect (at -2.4 -2.4 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 17 "+3.3VA") (pinfunction "VCCA") (pintype "power_in") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "75cf2d2a-cce4-4bdd-8b7b-d4b6174c3908") ) (pad "D5" smd roundrect (at -1.6 -2.4 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 4 "GND") (pinfunction "GND") (pintype "power_in") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "e836dadc-bd5b-422a-9119-0cc81b921cfb") ) (pad "D6" smd roundrect (at -0.8 -2.4 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 55 "unconnected-(U2-CRC_ERROR-PadD6)") (pinfunction "CRC_ERROR") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "7ca44fd0-343d-4081-953b-3d57f0b1ac50") ) (pad "D7" smd roundrect (at 0 -2.4 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 139 "unconnected-(U2-CONFIG_SEL-PadD7)") (pinfunction "CONFIG_SEL") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "96a1639a-eb02-4c9f-a2c5-2be4137455d1") ) (pad "D8" smd roundrect (at 0.8 -2.4 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 6 "+3.3V") (pinfunction "DEV_OE") (pintype "bidirectional") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "a732048f-e40a-4d2a-be4d-830c5c2026da") ) (pad "D9" smd roundrect (at 1.6 -2.4 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 144 "unconnected-(U2-TB$5-PadD9)") (pinfunction "TB$5") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "a5fc0fa5-787b-493c-88e5-d7165abde2df") ) (pad "D10" smd roundrect (at 2.4 -2.4 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 17 "+3.3VA") (pinfunction "VCCA") (pintype "power_in") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "b42723b2-aeef-4781-a595-faa7050816c3") ) (pad "D11" smd roundrect (at 3.2 -2.4 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 36 "unconnected-(U2-TB$8-PadD11)") (pinfunction "TB$8") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "3793b613-0451-4a15-a17f-9e56e02465ff") ) (pad "D12" smd roundrect (at 4 -2.4 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 117 "/FPGA/POKEY3.P21") (pinfunction "TB$10") (pintype "bidirectional") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "ebaa3df7-ca62-4b5d-a282-8f35b248a685") ) (pad "D13" smd roundrect (at 4.8 -2.4 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 125 "/FPGA/POKEY3.P22") (pinfunction "TB$12") (pintype "bidirectional") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "95f38a00-d890-4aca-9a77-54697d0d12ab") ) (pad "E1" smd roundrect (at -4.8 -1.6 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 113 "/FPGA/POKEY3.P38") (pinfunction "TT$3") (pintype "bidirectional") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "eb1e0ee2-e7fa-42e4-89b2-be4ad8166a5d") ) (pad "E2" smd roundrect (at -4 -1.6 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 34 "unconnected-(U2-NC-PadE2)") (pinfunction "NC") (pintype "no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "2eea8bc4-c35f-44a6-a0ed-0682ddef9f44") ) (pad "E3" smd roundrect (at -3.2 -1.6 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 95 "/FPGA/POKEY3.P39") (pinfunction "TT$2") (pintype "bidirectional") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "40e517fd-5cfa-46be-97d9-885daa03b7a2") ) (pad "E4" smd roundrect (at -2.4 -1.6 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 38 "unconnected-(U2-IO_UNUSED-PadE1)_4") (pinfunction "IO_UNUSED") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "4100e859-77bd-4746-b32f-bcb3e6653249") ) (pad "E5" smd roundrect (at -1.6 -1.6 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 49 "unconnected-(U2-JTAG_EN-PadE5)") (pinfunction "JTAG_EN") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "700efe7f-2230-48c5-9724-5121a769ff24") ) (pad "E6" smd roundrect (at -0.8 -1.6 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 41 "unconnected-(U2-IO_UNUSED-PadE1)_6") (pinfunction "IO_UNUSED") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "5ac6fc80-2e83-443a-bcef-5a135971e7d4") ) (pad "E7" smd roundrect (at 0 -1.6 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 6 "+3.3V") (pinfunction "NCONFIG") (pintype "bidirectional") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "e894da27-8318-491f-a081-6441d89ec341") ) (pad "E8" smd roundrect (at 0.8 -1.6 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 167 "unconnected-(U2-IO_UNUSED-PadE1)_21") (pinfunction "IO_UNUSED") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "fdaba31c-3719-4c0e-8435-d0baf2a49fa0") ) (pad "E9" smd roundrect (at 1.6 -1.6 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 53 "unconnected-(U2-IO_UNUSED-PadE1)_9") (pinfunction "IO_UNUSED") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "768159c9-b3bb-4aa6-8309-9ca7176a1d25") ) (pad "E10" smd roundrect (at 2.4 -1.6 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 155 "unconnected-(U2-IO_UNUSED-PadE1)_19") (pinfunction "IO_UNUSED") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "cfe0a35f-f6c9-45fa-8917-422348b8d8dc") ) (pad "E11" smd roundrect (at 3.2 -1.6 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 4 "GND") (pinfunction "GND") (pintype "power_in") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "998c077a-36d4-4965-b9f5-706bc580c1f0") ) (pad "E12" smd roundrect (at 4 -1.6 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 23 "unconnected-(U2-IO_UNUSED-PadE1)_1") (pinfunction "IO_UNUSED") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "0ed8ad0a-8b59-4f51-809d-9db5db9d52b5") ) (pad "E13" smd roundrect (at 4.8 -1.6 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 141 "unconnected-(U2-CLK3-PadE13)") (pinfunction "CLK3") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "9805570d-7cc1-4526-b113-7c0897afb773") ) (pad "F1" smd roundrect (at -4.8 -0.8 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 111 "/FPGA/POKEY3.P40") (pinfunction "TT$1") (pintype "bidirectional") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "3bb0464f-d9b2-401d-b004-79e4dbb61914") ) (pad "F2" smd roundrect (at -4 -0.8 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 6 "+3.3V") (pinfunction "VCCIO") (pintype "power_in") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "061ac809-1bbc-4375-ae20-be1cf1191d9b") ) (pad "F3" smd roundrect (at -3.2 -0.8 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 4 "GND") (pinfunction "GND") (pintype "power_in") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "98399f1b-58c3-4148-8c92-ba19a9a8ea64") ) (pad "F4" smd roundrect (at -2.4 -0.8 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 145 "unconnected-(U2-IO_UNUSED-PadE1)_14") (pinfunction "IO_UNUSED") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "a7846a77-f607-4bf5-aaaf-5edcb145ad48") ) (pad "F5" smd roundrect (at -1.6 -0.8 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 5 "/FPGA/TDI") (pinfunction "JTAG_TDI") (pintype "bidirectional") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "8f8b6c7e-3adc-4731-9a30-fb2c28b21e79") ) (pad "F6" smd roundrect (at -0.8 -0.8 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 9 "Net-(J1-Pin_6)") (pinfunction "JTAG_TDO") (pintype "bidirectional") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "1a8f373d-24ff-41cf-bfc8-184548281e42") ) (pad "F7" smd roundrect (at 0 -0.8 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 6 "+3.3V") (pinfunction "VCCONE") (pintype "power_in") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "c3ccf675-f9c4-41cf-8f50-da9619d5f836") ) (pad "F8" smd roundrect (at 0.8 -0.8 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 45 "unconnected-(U2-IO_UNUSED-PadE1)_7") (pinfunction "IO_UNUSED") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "6769f514-0961-41cb-ac7e-a1bda9588f27") ) (pad "F9" smd roundrect (at 1.6 -0.8 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 147 "unconnected-(U2-IO_UNUSED-PadE1)_15") (pinfunction "IO_UNUSED") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "ad7f6ebf-b050-4b49-9652-05f638b9c4ac") ) (pad "F10" smd roundrect (at 2.4 -0.8 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 143 "unconnected-(U2-IO_UNUSED-PadE1)_13") (pinfunction "IO_UNUSED") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "9f7f77a7-2a36-4d76-a801-d8b81c93c40f") ) (pad "F11" smd roundrect (at 3.2 -0.8 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 6 "+3.3V") (pinfunction "VCCIO") (pintype "power_in") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "86c4a30d-8351-4cce-a8e1-4cc7d262ec39") ) (pad "F12" smd roundrect (at 4 -0.8 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 154 "unconnected-(U2-IO_UNUSED-PadE1)_18") (pinfunction "IO_UNUSED") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "ced2f23e-778f-46d4-9d3e-776faaeb3517") ) (pad "F13" smd roundrect (at 4.8 -0.8 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 50 "unconnected-(U2-CLK4-PadF13)") (pinfunction "CLK4") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "71c9cd9f-cd7a-455a-ba20-8313ac15f1c1") ) (pad "G1" smd roundrect (at -4.8 0 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 8 "/FPGA/TMS") (pinfunction "JTAG_TMS") (pintype "bidirectional") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "210433d7-8a82-4be6-80f4-5fdcd8ade1d5") ) (pad "G2" smd roundrect (at -4 0 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 7 "/FPGA/TCK") (pinfunction "JTAG_TCK") (pintype "bidirectional") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "2b2b58f8-f082-44cc-82fc-e4caf53a691c") ) (pad "G3" smd roundrect (at -3.2 0 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 6 "+3.3V") (pinfunction "VCCIO") (pintype "power_in") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "cc07b908-755b-465d-98d3-8e50cdd9ca62") ) (pad "G4" smd roundrect (at -2.4 0 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 40 "unconnected-(U2-IO_UNUSED-PadE1)_5") (pinfunction "IO_UNUSED") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "58e4bc34-5cd0-453c-b62f-6c6a021d8318") ) (pad "G5" smd roundrect (at -1.6 0 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 31 "unconnected-(U2-IO_UNUSED-PadE1)_2") (pinfunction "IO_UNUSED") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "2cab641f-b5c9-4db6-bd7a-ff0f17ed43b2") ) (pad "G6" smd roundrect (at -0.8 0 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 6 "+3.3V") (pinfunction "VCCONE") (pintype "power_in") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "186d98ac-9d05-4a4a-ab6a-d3a94686ce1a") ) (pad "G7" smd roundrect (at 0 0 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 4 "GND") (pinfunction "GND") (pintype "power_in") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "975a67fb-6e31-462e-a341-8ab5abfd139c") ) (pad "G8" smd roundrect (at 0.8 0 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 6 "+3.3V") (pinfunction "VCCONE") (pintype "power_in") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "114357b3-5820-4aff-bb2f-3432d6f8258c") ) (pad "G9" smd roundrect (at 1.6 0 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 156 "Net-(U2-CLK2)") (pinfunction "CLK2") (pintype "bidirectional") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "f4984380-4b90-46a8-94ba-391b059612f4") ) (pad "G10" smd roundrect (at 2.4 0 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 135 "unconnected-(U2-IO_UNUSED-PadE1)_10") (pinfunction "IO_UNUSED") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "8de6b9a9-ef24-416c-8347-4da78284110a") ) (pad "G11" smd roundrect (at 3.2 0 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 6 "+3.3V") (pinfunction "VCCIO") (pintype "power_in") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "4346562e-9dce-43cc-ad34-e5f41fe8875e") ) (pad "G12" smd roundrect (at 4 0 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 146 "unconnected-(U2-BB$24-PadG12)") (pinfunction "BB$24") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "ad23277f-db4d-4bf6-acda-d9e38f0998f6") ) (pad "G13" smd roundrect (at 4.8 0 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 150 "unconnected-(U2-BB$25-PadG13)") (pinfunction "BB$25") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "c56c89d9-ac87-40b1-91be-bf2e0a8fdf5d") ) (pad "H1" smd roundrect (at -4.8 0.8 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 116 "/FPGA/POKEY3.P2") (pinfunction "TT$4") (pintype "bidirectional") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "b4569b28-14d4-413d-b675-db95800e3531") ) (pad "H2" smd roundrect (at -4 0.8 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 153 "unconnected-(U2-IO_UNUSED-PadE1)_17") (pinfunction "IO_UNUSED") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "ccd7db15-befd-4ecf-b623-eaa27e4d5576") ) (pad "H3" smd roundrect (at -3.2 0.8 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 142 "unconnected-(U2-IO_UNUSED-PadE1)_12") (pinfunction "IO_UNUSED") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "9f5d1984-a635-4fc0-9305-e4d0b0d0f025") ) (pad "H4" smd roundrect (at -2.4 0.8 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 25 "unconnected-(U2-CLK1-PadH4)") (pinfunction "CLK1") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "17edc33e-8ae3-4a04-914c-189850d53437") ) (pad "H5" smd roundrect (at -1.6 0.8 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 137 "unconnected-(U2-IO_UNUSED-PadE1)_11") (pinfunction "IO_UNUSED") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "951dc1ca-50b6-40c2-9e4e-a291cf65cc65") ) (pad "H6" smd roundrect (at -0.8 0.8 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 43 "unconnected-(U2-CLK0-PadH6)") (pinfunction "CLK0") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "667d4365-3893-429c-ae73-9afcc2021877") ) (pad "H7" smd roundrect (at 0 0.8 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 6 "+3.3V") (pinfunction "VCCONE") (pintype "power_in") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "e15b075f-769c-4968-96e8-9078cee9a1c9") ) (pad "H8" smd roundrect (at 0.8 0.8 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 156 "Net-(U2-CLK2)") (pinfunction "OUTBYCLK") (pintype "bidirectional") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "d763ef80-66f8-4655-a95e-7f325d98f311") ) (pad "H9" smd roundrect (at 1.6 0.8 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 149 "unconnected-(U2-IO_UNUSED-PadE1)_16") (pinfunction "IO_UNUSED") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "b1be205c-f986-4e50-8282-ebfcf293239b") ) (pad "H10" smd roundrect (at 2.4 0.8 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 163 "unconnected-(U2-IO_UNUSED-PadE1)_20") (pinfunction "IO_UNUSED") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "f3a68f1d-2ae7-4895-990b-84b3b52b6c54") ) (pad "H11" smd roundrect (at 3.2 0.8 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 6 "+3.3V") (pinfunction "VCCIO") (pintype "power_in") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "470772d3-14a4-48ac-8638-3ff6830b488b") ) (pad "H12" smd roundrect (at 4 0.8 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 4 "GND") (pinfunction "GND") (pintype "power_in") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "b0727a02-f8a6-4fcb-bb2f-b5935ebbd14b") ) (pad "H13" smd roundrect (at 4.8 0.8 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 127 "/FPGA/POKEY3.P20") (pinfunction "BB$26") (pintype "bidirectional") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "bb79db51-3d6e-4ef8-a8db-7270c4986340") ) (pad "J1" smd roundrect (at -4.8 1.6 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 110 "/FPGA/POKEY3.P3") (pinfunction "TT$5") (pintype "bidirectional") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "90d7eeba-263d-4c6e-9c98-a715a9ae544f") ) (pad "J2" smd roundrect (at -4 1.6 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 51 "unconnected-(U2-IO_UNUSED-PadE1)_8") (pinfunction "IO_UNUSED") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "75e11d42-9e38-4dd9-842e-c8aae3440f74") ) (pad "J3" smd roundrect (at -3.2 1.6 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 6 "+3.3V") (pinfunction "VCCIO") (pintype "power_in") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "3deca0b2-6cbb-4e45-8d92-3a39e7a74497") ) (pad "J4" smd roundrect (at -2.4 1.6 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 4 "GND") (pinfunction "GND") (pintype "power_in") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "32140561-6113-4421-a05b-57823e505333") ) (pad "J5" smd roundrect (at -1.6 1.6 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 54 "unconnected-(U2-BB$20-PadJ5)") (pinfunction "BB$20") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "7a7c7b3d-87a7-44f2-a400-b3509e988406") ) (pad "J6" smd roundrect (at -0.8 1.6 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 44 "unconnected-(U2-BB$21-PadJ6)") (pinfunction "BB$21") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "66dea6d9-f9ce-4602-9ba4-6c885aa5ea7c") ) (pad "J7" smd roundrect (at 0 1.6 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 47 "unconnected-(U2-BB$22-PadJ7)") (pinfunction "BB$22") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "6f8b2ffb-8b1d-42ed-a898-18a22d96bc84") ) (pad "J8" smd roundrect (at 0.8 1.6 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 165 "unconnected-(U2-BB$23-PadJ8)") (pinfunction "BB$23") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "f5ced307-3e74-4f19-b912-5b31e09ecbad") ) (pad "J9" smd roundrect (at 1.6 1.6 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 37 "unconnected-(U2-IO_UNUSED-PadE1)_3") (pinfunction "IO_UNUSED") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "37cf8c04-874d-4012-91e1-ac06a17dc39f") ) (pad "J10" smd roundrect (at 2.4 1.6 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 14 "unconnected-(U2-IO_UNUSED-PadE1)") (pinfunction "IO_UNUSED") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "02532603-d349-4a4a-b439-27148d767ef3") ) (pad "J11" smd roundrect (at 3.2 1.6 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 6 "+3.3V") (pinfunction "VCCIO") (pintype "power_in") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "b900e048-8037-4e8c-8e9d-a32422297a28") ) (pad "J12" smd roundrect (at 4 1.6 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 160 "unconnected-(U2-BB$27-PadJ12)") (pinfunction "BB$27") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "e33a8fbe-440d-4cb5-bf87-18d3319f04ae") ) (pad "J13" smd roundrect (at 4.8 1.6 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 107 "/FPGA/POKEY3.P19") (pinfunction "BB$28") (pintype "bidirectional") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "3b1bfcca-aa52-47f7-83ee-4909554588af") ) (pad "K1" smd roundrect (at -4.8 2.4 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 115 "/FPGA/POKEY3.P5") (pinfunction "BB$1") (pintype "bidirectional") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "e9cda1ff-e253-4693-8942-b85e245a5aab") ) (pad "K2" smd roundrect (at -4 2.4 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 129 "/FPGA/POKEY3.P4") (pinfunction "BB$3") (pintype "bidirectional") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "e2183773-07ba-4348-81e8-e01aab678b79") ) (pad "K3" smd roundrect (at -3.2 2.4 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 6 "+3.3V") (pinfunction "VCCIO") (pintype "power_in") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "40d533e2-4b61-4551-955f-ed51368ac23b") ) (pad "K4" smd roundrect (at -2.4 2.4 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 17 "+3.3VA") (pinfunction "VCCA") (pintype "power_in") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "6ff40de3-7a51-4763-86f4-fe174ddb8965") ) (pad "K5" smd roundrect (at -1.6 2.4 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 12 "unconnected-(U2-BB$7-PadK5)") (pinfunction "BB$7") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "0131ee47-3eed-4965-a142-8cea69b7381f") ) (pad "K6" smd roundrect (at -0.8 2.4 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 166 "unconnected-(U2-BB$9-PadK6)") (pinfunction "BB$9") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "f5feed7e-a215-4d62-9d8a-900f93d02942") ) (pad "K7" smd roundrect (at 0 2.4 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 32 "unconnected-(U2-BB$10-PadK7)") (pinfunction "BB$10") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "2ecd670e-a692-4a8e-b3da-57d215e5859f") ) (pad "K8" smd roundrect (at 0.8 2.4 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 136 "unconnected-(U2-BB$11-PadK8)") (pinfunction "BB$11") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "923b65be-dedd-4ae3-b99f-6c25c8181a6b") ) (pad "K9" smd roundrect (at 1.6 2.4 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 17 "+3.3VA") (pinfunction "VCCA") (pintype "power_in") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "1f251452-f73e-4578-b4b7-d6561428b0a3") ) (pad "K10" smd roundrect (at 2.4 2.4 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 56 "unconnected-(U2-BB$12-PadK10)") (pinfunction "BB$12") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "7edd86ab-e5a9-4faa-8158-952b6024f0fc") ) (pad "K11" smd roundrect (at 3.2 2.4 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 27 "unconnected-(U2-BB$14-PadK11)") (pinfunction "BB$14") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "243b30f7-02e1-44f8-9047-944742d98b78") ) (pad "K12" smd roundrect (at 4 2.4 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 28 "unconnected-(U2-BB$16-PadK12)") (pinfunction "BB$16") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "246f3214-4a1e-49d6-b9e7-0dce9b746025") ) (pad "K13" smd roundrect (at 4.8 2.4 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 120 "/FPGA/POKEY3.P18") (pinfunction "BB$18") (pintype "bidirectional") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "bf573fdb-3892-4507-8cb2-9c80f03e3f2c") ) (pad "L1" smd roundrect (at -4.8 3.2 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 104 "/FPGA/POKEY3.P6") (pinfunction "BB$2") (pintype "bidirectional") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "9544e1dc-3b12-4f52-8af8-84eac574922e") ) (pad "L2" smd roundrect (at -4 3.2 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 162 "unconnected-(U2-BB$4-PadL2)") (pinfunction "BB$4") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "ec23c8df-f437-40ad-8fbb-5a4cf06166f2") ) (pad "L3" smd roundrect (at -3.2 3.2 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 159 "unconnected-(U2-BB$5-PadL3)") (pinfunction "BB$5") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "e092e65b-d0b3-4c7b-9835-c4f267122436") ) (pad "L4" smd roundrect (at -2.4 3.2 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 122 "/FPGA/POKEY3.P10") (pinfunction "BB$6") (pintype "bidirectional") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "7487d15c-6774-42ca-bfca-2907f76007b4") ) (pad "L5" smd roundrect (at -1.6 3.2 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 21 "/FPGA/PTHRES") (pinfunction "BB$8") (pintype "bidirectional") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "d3c3217e-cb31-421f-99d1-f59ea942167b") ) (pad "L6" smd roundrect (at -0.8 3.2 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 16 "+2V5") (pinfunction "VCCIOBANK3") (pintype "power_in") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "f97a7bab-b0ad-4f1b-8478-4f0c3d72a1ad") ) (pad "L7" smd roundrect (at 0 3.2 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 16 "+2V5") (pinfunction "VCCIOBANK3") (pintype "power_in") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "a382dee7-e8f9-4bc3-809b-58babe81d71f") ) (pad "L8" smd roundrect (at 0.8 3.2 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 16 "+2V5") (pinfunction "VCCIOBANK3") (pintype "power_in") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "e83f1d04-7ff8-4e3a-bb76-f038a15b21de") ) (pad "L9" smd roundrect (at 1.6 3.2 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 4 "GND") (pinfunction "GND") (pintype "power_in") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "26ecbfe1-3b67-4ab0-af90-1816df7b1988") ) (pad "L10" smd roundrect (at 2.4 3.2 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 97 "/FPGA/POKEY3.P15") (pinfunction "BB$13") (pintype "bidirectional") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "06d8e1ca-0df7-4142-9eea-361f3505f313") ) (pad "L11" smd roundrect (at 3.2 3.2 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 132 "unconnected-(U2-BB$15-PadL11)") (pinfunction "BB$15") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid "81b94d36-6c0f-45f5-9fca-bf763fe3c383") ) (pad "L12" smd roundrect (at 4 3.2 270) (size 0.4 0.4) (layers "F.Cu" "F.Mask" "F.Paste") (roundrect_rratio 0.5) (net 158 "unconnected-(U2-BB$17-PadL12)") (pinfunction "BB$17") (pintype "bidirectional+no_connect") (solder_mask_margin 0.1016) (thermal_bridge_angle 0) (uuid 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